| 摘要 |
A method for sealing a transducer of a type having a diaphragm with an active region and an inactive region, a stress sensing network associated with the active region of the diaphragm, contacts associated with the inactive region of the diaphragm, and lead-outs for coupling the stress sensing network to the contacts. The method comprises oxidizing the transducer to provide a first oxide layer which covers the diaphragm, the stress sensing network, the lead-outs and the contacts. Next, a layer of semiconductive material is deposited over the first oxide layer and is then planarized to provide a planar surface having a substantially flat and bondable surface. Finally, a cover member is bonded to the planar surface of the layer which covers the inactive region of the diaphragm to hermetically seal the stress sensing network and thereby provide a sealed transducer.
|
