发明名称 Method of fabricating hemispherical grain electrode
摘要 A method of fabricating an HSG electrode. An electrode is defined before the formation of an HSG layer. The HSG layer is then formed on the top surface and the side wall of the electrode. The HSG layer is thermal oxidized in a furnace by rapid thermal process, and a silicon oxide layer is formed on the surface of the HSG layer. Dipping the electrode into a dilute solution of hydrogen fluoride or buffered oxide etching (BOE), the silicon oxide layer is lifted off while an HSG structure is remained on the top surface and the side wall of the electrode.
申请公布号 US6228709(B1) 申请公布日期 2001.05.08
申请号 US19980010684 申请日期 1998.01.22
申请人 UNITED MICROELECTRONICS CORP. 发明人 HSIEH WEN-YI
分类号 H01L21/02;H01L21/311;H01L21/8242;(IPC1-7):H01L21/824 主分类号 H01L21/02
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