EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing semiconductors good in curability, having high potentiality and good in shelf life. SOLUTION: This epoxy resin composition is characterized as comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler and (D) a microencapsulted catalyst containing an imidazole compound and/or an organophosphorus compound and having 0.5-50μm average particle diameter and >=70 wt.% total amount of elution of the catalyst from the microcapsule in o-cresol based on the total amount of the catalyst contained in the microcapsule at 30 deg.C for 15 min.