METHOD OF MANUFACTURING GRINDING TOOL

摘要

PROBLEM TO BE SOLVED: To providing a manufacturing method for a grinding tool for removing an insulating layer and solder chips from an IC socket. SOLUTION: The manufacturing method for the grinding tool has a plurality of hemispherical projections made of rubber containing an abrasive material and having a JIS (A) hardness of 30-95. The content of the abrasive material in the rubber is 5-50 wt.%. The abrasive material contains at least silicon carbide(SiC), and its grain size is 400-2000 mesh. The rubber is at least urea rubber or silicone rubber.