Bump structure, bump forming method and package connecting body

摘要

To provide a bump structure for soldering by forming a solder layer on the chip surface while keeping the space between a package substrate and a semiconductor chip large. Form a bump structured in double layers at a chip 1 and connect it to an electrode 11 of a package substrate 10 by soldering. The lower layer 3a in the double-layer structure does not fuse in soldering, and a definite distance between the substrate and the chip can be maintained. The upper layer 3b actually fuses in soldering and operates to electrically connect the bump to the electrode on the package substrate. The melting point of the lower layer is preferably at least 20° C. higher than that of the upper layer.