发明名称 Photo-sensitive material, method of forming a resist pattern and manufacturing an electronic parts using photo-sensitive material
摘要 A photosensitive material, which comprises, an alkali-soluble resin moiety having an alicyclic skeleton, a polycyclic condensation skeleton, or both alicyclic and polycyclic condensation skeletons, and a diazo compound moiety. The diazo compound moiety may be contained in a side chain of the alkali-soluble resin moiety or included in the photosensitive material in separate from the alkali-soluble resin moiety.
申请公布号 US6228552(B1) 申请公布日期 2001.05.08
申请号 US19970927411 申请日期 1997.09.10
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 OKINO TAKESHI;ASAKAWA KOJI;SHIDA NAOMI;USHIROGOUCHI TORU;NAKASE MAKOTO
分类号 G03F7/004;G03F7/021;G03F7/023;G03F7/095;G03F7/20;(IPC1-7):G03F7/021;G03F7/30;G03F7/38 主分类号 G03F7/004
代理机构 代理人
主权项
地址