发明名称 FOAM MOLDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a foam molding apparatus capable of accurately superposing a lower mold, an upper mold and a core mold one upon another and enhancing the self-sealing properties of a foaming mold and preventing the flaw of a product part such that the destruction of cells is generated in a pad material and uniform hardness is not obtained. SOLUTION: A narrow clearance 21c is provided between the mold Register surfaces of the lower mold 12 and the core mold 15 at a part P where the mating mold surfaces of the lower mold 12, upper mold 13 and core mold 15 of a foaming mold 11 come into contact with each other at one point. The gap part 25 communicating with a molding space filled with a raw liquid of a foamable synthetic resin is formed to the mating mold surface of the lower mold 12 of the upper part of the clearance 21c. The raw liquid 23 of the foamable synthetic resin is allowed to penetrate in the gap part 25 from the molding space and the part P where the mating mold surfaces of the lower mold 12, upper mold 13 and core mold 15 of the foaming mold 11 come into contact with each other at one point is sealed with the raw liquid 23 of the foamable synthetic resin.
申请公布号 JP2001121544(A) 申请公布日期 2001.05.08
申请号 JP19990305183 申请日期 1999.10.27
申请人 IKEDA BUSSAN CO LTD 发明人 KODA HIROSHI
分类号 B29C33/10;B29C39/28;(IPC1-7):B29C33/10 主分类号 B29C33/10
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