| 发明名称 |
COPPER EROSION PREVENTIVE LEAD-FREE SOLDER |
| 摘要 |
PROBLEM TO BE SOLVED: To provide copper erosin preventive lead-free solder excellent in the copper erosin preventing characteristics of solder and mechanical properties. SOLUTION: This copper erosin preventive lead-free solder has a composition consisting essentially of Sn, and the balance copper of 5.5 to 8.0 mass %.
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| 申请公布号 |
JP2001121286(A) |
申请公布日期 |
2001.05.08 |
| 申请号 |
JP19990302359 |
申请日期 |
1999.10.25 |
| 申请人 |
ISHIKAWA KINZOKU KK |
发明人 |
MATSUMOTO TOSHIO;MURAOKA NAOKI;OMOTO TAKAHIKO;MOMODA MOTOE |
| 分类号 |
B23K35/26;C22C13/00;(IPC1-7):B23K35/26 |
主分类号 |
B23K35/26 |
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