发明名称 |
Method and apparatus for polishing the outer periphery of disc-shaped workpiece |
摘要 |
The outer periphery of a workpiece (semiconductor wafer) 42 is caused to come into contact with an abrasive material (abrasive cloth) 28 in a cylindrical polishing drum 23, and the polishing drum 23 and the workpiece 42 are relatively rotated, whereby the region where the outer periphery of the workpiece is in contact with the abrasive cloth 28 is increased and a polishing effect can be increased.
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申请公布号 |
US6227945(B1) |
申请公布日期 |
2001.05.08 |
申请号 |
US19990316785 |
申请日期 |
1999.05.21 |
申请人 |
KYOKUEI KENMAKAKO KABUSHIKI KAISHA |
发明人 |
TAKAHASHI SHUZO;HIRABAYASHI TOSHIHIKO |
分类号 |
B24B9/00;B24B9/06;B24D9/04;H01L21/304;(IPC1-7):B24B9/06 |
主分类号 |
B24B9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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