| 摘要 |
A multilayer wiring board of this invention includes first and second power source patterns of a first potential and a third power source pattern of a second potential. A wiring pattern formed in a signal wiring layer is positioned between the first power source pattern of the first potential and the third power source pattern of the second potential. A hole is connected to the wiring pattern and passes through the first and second power source patterns of the first potential and the third power source pattern of the second potential. A first gap is formed between the first power source pattern of the first potential and the hole. A second gap is formed between the second power source pattern of the first potential and the through hole and is larger than the first gap. Another multilayer wiring board of the present invention includes a top surface, a signal wiring provided on the top surface, a first power source pattern formed in a first power source layer in a position which is the closest to the signal wiring, a second power source pattern formed in a second power source layer and a hole which is connected to the signal wiring and passes through the first and second power source patterns. A first gap is formed between the first power source pattern and the through hole. A second gap is formed between the second power source pattern and the through hole and is larger than the first gap.
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