| 摘要 |
An integrated thermal buckling micro switch is made by using electromechanical technology to integrate sensors and actuators on a single chip. An epitaxial chip is used and etched to form a mesa structure on a thin silicon film, whereon at least a thermal sensing element and a heating element are disposed. When an output signal of the thermal sensing element is greater than a pre-set critical value in a control circuit, the heating element is driven to heat, so that the thin silicon film will create a thermal buckling effect that makes the mesa structure touch at least one contact point on the baseboard to cut off or effectuate the circuit. On the contrary, when heating is ceased, the mesa structure will return back to the original normal state, and thereby, switching and controlling an external load can be achieved.
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