ADHESIVE FOR ADDITIVE PROCESS PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide an adhesive composition for an additive process printed circuit board having excellent adhesivity to plated copper without deteriorating the insulation performance. SOLUTION: The objective adhesive is used for the production of an additive process printed circuit board to form a circuit by coating an insulated substrate with an adhesive, chemically roughening the surface of the adhesive layer and forming a circuit exclusively on the necessary part by electroless plating. The adhesive is characterized by the use of a core-shell type crosslinked rubber as a component of the adhesive.