METHOD OF MANUFACTURING PRINTED WIRING BOARD FOR SURFACE MOUNTED PARTS

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board for surface mounted parts capable of reducing mounting defectives by preventing a Manhattan phenomenon when mounting surface mounted parts making printed wiring plates having electrodes for surface mounting formed by a plating method so as to cover both end parts formed by slit working using a punching metallic mold as structural materials. SOLUTION: This manufacturing method is characterized by a punch pin 14 to be used at the time of slit working as a stepped pin provided with a projecting part 18 of a width narrower than a width to be slit-worked at a tip center part of the punch pin 14 and provided with a step part 16 between the projecting part 18 and a side end 17 for forming slit working surface. The method is characterized by a step part 6 of the stepped pin as the step part 6 inclined in an opposite direction of a tip of the stepped pin from the side end 17 side toward the projecting part 18 side.