| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin molding material for sealing having a high adhesive strength even under conditions of high temperatures and high pressures and to provide an electronic part device provided with an element sealed therewith and excellent in moisture-resistant reliability and thermal shock resistance. SOLUTION: This epoxy resin molding material for sealing consists essentially of (A) a liquid epoxy resin, (B) a liquid aromatic amine-based curing agent, (C) an epoxidized polybutadiene compound and (D) an inorganic filler. The amount of the compounded component (C) is 12-34 wt.% based on the total amount of the components (A), (B) and (C). The electronic part device is provided with the element sealed with the epoxy resin molding material for sealing.
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