| 发明名称 |
Semiconductor device and manufacturing method thereof |
| 摘要 |
In a semiconductor device 1 having a first semiconductor chip 11 mounted at a front surface of a substrate 10 and a plurality of bumps 15 formed at a rear surface of the substrate 10, a second semiconductor chip 17 is mounted at an area 16 formed at the center of the rear surface of the substrate 10 where the bumps 15 are not present.
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| 申请公布号 |
US6229215(B1) |
申请公布日期 |
2001.05.08 |
| 申请号 |
US19980177822 |
申请日期 |
1998.10.23 |
| 申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
EGAWA YOSHIMI |
| 分类号 |
H01L23/28;H01L21/56;H01L21/60;H01L23/12;H01L25/065;H01L25/07;H01L25/18;(IPC1-7):H01L23/48;H01L29/40;H01L23/52 |
主分类号 |
H01L23/28 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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