发明名称 |
THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE FOR ELECTRIC WIRING BOARD USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To obtain a material capable of achieving flame retardance standard UL94V-0 without substantially containing a halogen or an antimony compound and a laminate scarcely causing the delamination when carrying out blanking processing. SOLUTION: This thermosetting resin composition is obtained by adding an inorganic filler in an amount of 5-250 pts.wt. based on 100 pts.wt. of a modified epoxy resin consisting essentially of (a) an epoxy resin, (b) a thermosetting resin comprising a compound having a dihydrobenzoxazine ring and (c) a polycondensate of phenols with a compound having a triazine ring and aldehydes thereto.
|
申请公布号 |
JP2001122949(A) |
申请公布日期 |
2001.05.08 |
申请号 |
JP19990307511 |
申请日期 |
1999.10.28 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
OHORI KENICHI;KAMOSHITA SHINICHI;KAKIYA MINORU;ABE NORIHIRO;SAKAI HIROSHI |
分类号 |
H05K1/03;C08G59/50;C08G59/62;C08J5/24;C08K3/00;C08L63/00;(IPC1-7):C08G59/50 |
主分类号 |
H05K1/03 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|