发明名称 THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE FOR ELECTRIC WIRING BOARD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To obtain a material capable of achieving flame retardance standard UL94V-0 without substantially containing a halogen or an antimony compound and a laminate scarcely causing the delamination when carrying out blanking processing. SOLUTION: This thermosetting resin composition is obtained by adding an inorganic filler in an amount of 5-250 pts.wt. based on 100 pts.wt. of a modified epoxy resin consisting essentially of (a) an epoxy resin, (b) a thermosetting resin comprising a compound having a dihydrobenzoxazine ring and (c) a polycondensate of phenols with a compound having a triazine ring and aldehydes thereto.
申请公布号 JP2001122949(A) 申请公布日期 2001.05.08
申请号 JP19990307511 申请日期 1999.10.28
申请人 HITACHI CHEM CO LTD 发明人 OHORI KENICHI;KAMOSHITA SHINICHI;KAKIYA MINORU;ABE NORIHIRO;SAKAI HIROSHI
分类号 H05K1/03;C08G59/50;C08G59/62;C08J5/24;C08K3/00;C08L63/00;(IPC1-7):C08G59/50 主分类号 H05K1/03
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