METHOD AND APPARATUS FOR PLATING

摘要

PROBLEM TO BE SOLVED: To prevent the etching and corrosion of the surface of a wafer when the wafer which is to be plated is brought into contact with a plating solution without power supply in a plating apparatus for electroplating. SOLUTION: A constant voltage source and a cathode electrode which can constantly apply a weak voltage to the wafer and a constant voltage source which can supply power to a pre-processing tank and a post-processing tank such as a water-cleaning tank similarly to a plating tank are provided to solve the problem. The power source can be easily controlled by connecting the output of the constant current source to the constant voltage source in parallel to make the ON-OFF control of the output of the constant voltage source unnecessary. Thus the etching and corrosion of the surface of the wafer can be prevented, and the power source can be easily controlled.