| 摘要 |
PURPOSE: A preparation method of thin lithographic board for inner/outer packaging of building structure is provided, which laminates multiple lithographic materials whose surface treatment is completed at the upside and downside by using a bond. CONSTITUTION: A preparation method of thin lithographic board for inner/outer packaging of building structure comprises the following steps: (i) performing a surface treatment at the upside and downside surface; (ii) bonding a bond at the upper side of both ending section of the lithographic material whose surface treatment is completed in a regular width; (iii) putting another lithographic material on the top section of the lithographic material; (iv) forming a uniform lithographic material block where multiple lithographic materials are laminated; (v) locating the manufactured uniform lithographic material block at the stone grinder so as to ease cutting by rotating the uniform block in predetermined angle; (vi) cutting the middle section of the lithographic material.
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