PROBE CARD FOR TEST OF SEMICONDUCTOR CHIP

摘要

PURPOSE: A probe card for test of a semiconductor chip is provided not to leave a probing trace on a pad within the semiconductor chip upon test operation by placing a probe needle with a printed circuit film having a bump pattern and a probing pattern. CONSTITUTION: A printed circuit board(100) has a disc shape whose center part is opened. A plurality of Ag patterns(102) are formed along edge in upper surface of the printed circuit board. A print circuit film(104) is fixed on center of the upper surface of the printed circuit board to cover with the open part. A plurality of bump pattern(108) are formed along the edge in an upper surface of the printed circuit board, and is coupled with the Ag pattern electrically through the signal lines printed on the printed circuit board. A plurality of probing patterns(110) are formed on predetermined part in a lower surface of the printed circuit film and is coupled with the bump pattern electrically through the signal lines printed on the printed circuit film.