| 摘要 |
PURPOSE: A memory module is provided to facilitate the dissipation of heat generated therefrom. CONSTITUTION: The memory module includes a printed circuit board(100) having openings formed therein at predetermined intervals, and a heat sink(260) having projection parts(a) corresponding to the openings. The memory module further includes package bodies(200) each containing a semiconductor chip therein, and leads(220) protruded from each package body(200). The package bodies(200) are disposed above the printed circuit board(100), whereas the heat sink(260) is disposed under the printed circuit board(100). The projection parts(a) of the heat sink(260) are inserted into the openings in the printed circuit board(100) and then attached to the package bodies(200) by adhesive materials(280) coated on the projection parts(a). Therefore, heat generated from the package bodies(200) can be easily dissipated through the heat sink(260).
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