| 摘要 |
PURPOSE: A system for removing a cover lay used for a manufacture of a semiconductor device is provided to enable an automatic operation. removal of the cover lay attached to a lead frame. CONSTITUTION: The cover lay is attached to upper and lower sides of a lead frame to facilitate an encapsulation process. After the process, the cover lay is detached and removed from the lead frame. In the removing system, the lead frame is supplied from a magazine by a lead frame loader(20). The supplied lead frame is then transferred by the first conveyor(32), and the cover lay attached to one side of the lead frame is detached by the first removal unit(62,74) installed in the middle of the first conveyor(32). The lead frame is then turned over by the first overturning unit(84) and transferred again by the second conveyor(92). Next, the cover lay attached to the other side of the lead frame is detached by the second removal unit(96) installed in the second conveyor(92). The lead frame from which the cover lay is removed is then discharged to the magazine by a lead frame unloader(100).
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