LEAD FRAME AND SEMICONDUCTOR PACKAGE USING THE SAME

摘要

PURPOSE: A lead frame and a semiconductor package using the lead frame are provided to ease formation of a silver plating layer with a relaxed tolerance. CONSTITUTION: The lead frame(20) includes a plate-shaped frame body(22), a plurality of tie bars(28) extended inward from corners of the frame body(22), a chip mounting plate connected to the tie bars(28), a plurality of inner leads(6) disposed radially along and apart from sides of the chip mounting plate, outer leads(26) extended from the inner leads(6) and linked to the frame body(22), and a dam bar crossing between the inner leads(6) and the outer leads(26). Moreover, the silver plating layer(30) is formed on the inner leads(6) to a boundary line(32) of a package body to be formed in a following process. When the lead frame(20) is used for the package in following processes, the silver plating layer(30) enhances bonding strength of conductive wires connected thereto.