| 摘要 |
PURPOSE: A semiconductor circuit is provided to prevent a latch-up phenomenon and to reduce a chip area, by separating input/output parts and an internal circuit by an N-type guard ring region under a bonding pad. CONSTITUTION: An internal circuit(22) is formed in a central portion of a semiconductor substrate(21) of the first conductivity type. A guard ring region(23) of the second conductivity type surrounds the internal circuit, separated from the internal circuit by a predetermined interval. A plurality of bonding pads(24) are formed on the guard ring region, separated from each other by a predetermined interval. A plurality of input/output parts(25) are formed on the bonding pad.
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