SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to improve a solder joint force of the package being mounted onto a mother board. CONSTITUTION: The package(100) includes a semiconductor chip(2) having a plurality of input/output pads(2a), a chip mounting plate(4) glued to the bottom of the chip(2), a plurality of inner leads(6) disposed apart from sides of the chip mounting plate(4), conductive wires(8) electrically connecting the input/output pads(2a) with the inner leads(6), and a package body(10) encapsulating the chip(2) and the wires(8) but exposing the bottom of the chip mounting plate(4) and the bottom and outer sides of the inner leads(6). In particular, during a singulation process for the package(100), a burr is formed upward on the outer side of the inner leads(6). Therefore, the burr does not affect the solder joint force while the package(100) is mounted onto the motherboard. Additionally, undesirable peeling off of a plating layer(30) under the inner leads(6) is prevented.