| 摘要 |
PURPOSE: A stacked micro ball grid array package and a manufacturing method thereof are provided to allow a stacking of flip-chip type individual packages. CONSTITUTION: In the stacked package, a molded case(14) has an inner space and a plurality of holes formed in both sides thereof. The molded case(14) further has a chip paddle(19) formed at a lower side thereof. Pluralities of leads(13) are inserted respectively into the holes of the case(14) and bent inward to form top and bottom portions(13a,13b) thereof. A semiconductor chip(11) having chip pads(11a) is placed on the chip paddle(19). The first insulating layer(15a) are coated on the chip(11) except nickel bumps(12) formed above the chip pads(11a). The bumps(12) are connected to the top portions(13a) of the leads(13) by conductors(16). The first lands(17a) are attached on the top portions(13a) of the leads(13), whereas the second lands(17b) are attached under the bottom portions(13b). The second insulating layer(15b) is coated on the first insulating layer(15a), and then the third insulating layer(15c) is coated thereon. The fourth insulating layer(15d) is coated under the chip paddle(19), and solder balls(18) are mounted under the second lands(17b).
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