发明名称 |
SOLVENT SYSTEM FOR SOLDERING FLUX COMPOSITION, FLUX COMPOSITION FLUX COMPOSITION COMPRISING THE SAME, AND MANUFACTURING METHOD THEREOF |
摘要 |
PURPOSE: A flux composition flux composition is provided which is environment friendly, less harmful to human body and restrains flammability and explosiveness by replacing isopropyl alcohol with dichloropropane which does not belong to volatile organic compound. CONSTITUTION: The solvent system for a soldering flux composition comprises a main constituent of dichloropropane, wherein the solvent system comprises 60 to 90 vol.% of dichloropropane, 1 to 10 vol.% of alcohol stabilizer having 1 to 4 carbon atoms, 0.01 to 1 vol.% of amine base and/or ester base chlorine capturing agent, and 30 vol.% or less of boiling point controlling agent selected from the group consisting of dichloro fluoro ethane and carbinol compound based on the total volume of the solvent system.
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申请公布号 |
KR20010036952(A) |
申请公布日期 |
2001.05.07 |
申请号 |
KR19990044164 |
申请日期 |
1999.10.12 |
申请人 |
DAEYOUNG CHEMI CO., LTD.;KOKI SANEI KOREA CO., LTD.;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHO, GI SU;JANG, YONG UN;LEE, TONG YEONG;SAITTOSYOJO |
分类号 |
B23K35/00;(IPC1-7):B23K35/00 |
主分类号 |
B23K35/00 |
代理机构 |
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