发明名称 METHOD FOR MANUFACTURING OXIDE LAYER USING PLASMA
摘要 PURPOSE: A method for manufacturing an oxide layer using plasma is provided to maintain the stability of forming the oxide layer, by reducing the first wafer effect, and by minimizing scattering of the thickness of the oxide layer with reference to an objective value. CONSTITUTION: The inside of a chamber for performing an oxide layer is cleaned by using radio frequency. A pro-coating process is performed after the radio frequency cleaning process. The inside of the chamber is purged after the pro-coating process. A deposition process for forming the oxide layer is carried out, wherein plasma prevent the first wafer effect to reduce scattering of the thickness of the oxide layer.
申请公布号 KR20010036739(A) 申请公布日期 2001.05.07
申请号 KR19990043865 申请日期 1999.10.11
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, GWANG JAE;KWON, GYEONG SU
分类号 H01L21/316;(IPC1-7):H01L21/316 主分类号 H01L21/316
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