DEVICE FOR DETECTING END POINT OF CHEMICAL AND MECHANICAL POLISHING

摘要

PURPOSE: A device for detecting the end point of chemical and mechanical polishing is provided to directly measure friction force applied to a wafer through a pressure sensor mounted on a retaining ring and to detect the end point of polishing in higher sensitivity. CONSTITUTION: A device for detecting the end point of chemical and mechanical polishing includes pressure sensors(200) and a monitor part(500). The pressure sensors are mounted in the inside of a retaining ring(130) of a carrier(110) rotating a wafer(300) and sense pressure transferred from the wafer. The monitor part monitors signal detected from the pressure sensor and detects end point of polishing according to a change of pressure. The pressure sensors are arranged in the form of a ring inside the retaining ring. The pressure sensor has the same inner diameter as the retaining ring.