| 摘要 |
PURPOSE: A grinding pad for grinding the surface of wafer makes a uniform grinding by preventing the generation of different grinding and removing quantities according to the respective portions of the wafer. CONSTITUTION: A grinding pad for grinding the surface of wafer comprises a base pad(100), many track areas(210',230',250',270',290') and many abrasive structures(210,230,250,270,290). The base pad(100) has circular shape. The track areas surround the surface of the base pad(100) as ring shapes. The abrasive structures are arranged to correspond to the track areas, respectively. Thus, the total surface of the wafer is uniformly grinded.
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