COUPLING METHOD AND COUPLING APPARATUS FOR SUBSTRATE SHEET

摘要

PURPOSE: A coupling method and coupling apparatus for substrate sheet is provided to reduce cost and prevent deformation of the substrate sheet junction during post-process by improving the stiffness of the junction of the substrate sheet coupled with a non-defective printed circuit board(PCB). CONSTITUTION: An apparatus comprises a substrate location determining unit(12) for determining the location of PCBs(2,21) by inserting a substrate fixing pin(6) protruded from a substrate mounting plate(1), into a pin insertion hole(7) of a non-defective PCB(21) which is to be inserted into a cutaway groove(22); a substrate fixing unit(11) formed integrally with the substrate mounting plate so as to prevent movement of the non-defective PCB(21) which is inserted to a substrate sheet(4) through a connection portion(20'); a space for jointing the non-defective PCB with the substrate sheet fixed onto the substrate mounting plate; and an adhesion member which fills the space between the substrate sheet and the non-defective PCB disposed in the substrate sheet so as to allow the non-defective PCB to adhere to the substrate sheet.