METHOD FOR ATTACHING CHIP-ON-BOARD OF SMART CARD

摘要

PURPOSE: A method for attaching a chip-on-board(COB) of a smart card is provided to prevent a semiconductor chip from being damaged by heat and pressure while making both side adhesive tape adhere a base plate to the COB firmly, by temporarily pressuring and heating only both side adhesive tape of the smart card. CONSTITUTION: A chip-on-board(COB)(130) is mounted in a base plate(110) having a mounting groove(115) for the COB. Supersonic waves and predetermined pressure are applied to an interface between the COB and the mounting groove of the COB contacting the COB to attach the COB to the base plate.