发明名称 COVER OF SOCKET FOR BALL GRID ARRAY TYPE INTEGRATED CIRCUIT
摘要 PURPOSE: A cover of a socket used for a ball grid array type integrated circuit is provided to prevent a mis-assembling of the cover in a wrong direction. CONSTITUTION: A semiconductor integrated circuit such as a ball grid array is loaded in the socket. The socket includes a body, which receives the integrated circuit therein, and the cover(20), which covers the body to protect the integrated circuit. The cover(20) has four fastening protrusions(26,27,28,29) which are formed on peripheral edges of the cover(20). The fastening protrusions(26,27,28,29) correspond to fastening grooves formed on the body and particularly have different widths(a,a+1,a+2,a+3), respectively. Therefore, the cover(20) can be easily assembled with the body along a correct assembling direction.
申请公布号 KR20010036421(A) 申请公布日期 2001.05.07
申请号 KR19990043431 申请日期 1999.10.08
申请人 LG INNOTEC CO., LTD. 发明人 LEE, JONG SEOK
分类号 H01L23/32;(IPC1-7):H01L23/32 主分类号 H01L23/32
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