SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to suppress a chip out phenomenon during a package singulation and thereby to prevent moisture penetration as well as to protect a bonding region. CONSTITUTION: The package(100) includes a semiconductor chip having a plurality of input/output pads, a chip mounting plate(4) glued to the bottom of the chip, a plurality of tie bars(28) extended outward from corners of the chip mounting plate(4), a plurality of inner leads(6) disposed outward and apart from sides of the chip mounting plate(4), conductive wires electrically connecting the input/output pads with the inner leads(6), and a package body(10) encapsulating the chip and the wires but exposing the bottom of the chip mounting plate(4) and the bottom and an outer side of each inner lead(6). In particular, the package body(10) has chamfer corners(12) where the tie bars(28) are terminated. The chamfer corners(12) are formed by a separate prior cutting for the tie bars(28) before conventional cuttings for the inner leads(6).