APPARATUS FOR BONDING ADHESIVE TAPE

摘要

PURPOSE: An apparatus for bonding adhesive tape is provided to improve reliability of a semiconductor chip package, by preventing a void generated between the adhesive tape and a semiconductor chip in bonding the adhesive tape to the semiconductor chip. CONSTITUTION: A vacuum hole(13) is formed in a body(12) of a collet(11) to absorb adhesive tape(23) with vacuum. The central portion of the body of the collet is protruded more than the edge portion of the body of the collet. The vacuum hole is formed in a position corresponding to the edge portion of the adhesive tape.