CIRCUIT BOARD PACKAGING STRUCTURE

摘要

A circuit board packaging structure avoids perforating a board with holes, while maintaining the strength of the board, securing a wide degree of freedom in wiring design on the board and permitting great wire accommodatability when packaging the board in an equipment using optical modules. Both surfaces of the board are made conductive through an electric connector. On the inner surface of the board, a second electric connector of an individual unit oriented package board is connected to this electric connector. On the outer surface of the board, a photoelectric converting device constituting a subscriber-side optical module is connected to this electric connector. An optical connector constituting the subscriber-side optical module is connected to this photoelectric converting device. A subscriber-side optical cable is connected to this optical connector. An optical signal from the subscriber-side optical cable is converted into an electric signal and can be transmitted to the individual unit package board without requiring a hole in the board through which the optical cable passes.