发明名称 CHEMICAL MECHANICAL POLISHING COMPOSITIONS AND SYSTEMS
摘要 <p>A polishing composition comprising cyanuric containing additive. Also disclosed, is a CMP system comprising an abrasive, an oxidizing agent, at least one cyanuric containing additive, and optionally a complexing agent, film forming agent and dispersing agent.</p>
申请公布号 WO2001030928(A1) 申请公布日期 2001.05.03
申请号 US2000030260 申请日期 2000.10.30
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