BAKING UNIT FOR SEMICONDUCTOR FABRICATING APPARATUS

摘要

PURPOSE: A baking unit for a semiconductor fabricating apparatus is provided to prevent a photoresist layer coated on a wafer from getting irregular by a decrease in temperature of the inside of the baking unit due to exhaust of a gas. CONSTITUTION: The baking unit for removing moisture and solvent in the photoresist layer coated on the wafer(15) includes a baking body(10) having a baking plate(13) disposed therein and an exhaust line(14) connected thereto. The baking plate(13) applies heat to the wafer(15) mounted thereon to vaporize parts of the photoresist layer. The exhaust line(14) communicates with the baking body(10) by an exhaust hole(12) to drain a vaporized gas from the baking body(10). The baking unit further includes a temperature compensating member having a variable resistor switch(22) connected to an exhaust valve(16) regulating a flow rate of the vaporized gas, a heating board(24) connected to the variable resistor switch(22), and a hot wire(28) connected to the heating board(24) and formed around the exhaust hole(12). According to the extent of opening of the exhaust valve(16), the variable resistor switch(22) varies in resistance and the heating board(24) generates different current for emitting heat from the hot wire(28).