| 摘要 |
PURPOSE: A cooling water supply device for manufacturing a semiconductor is provided to maintain constantly a vacuum status by preventing an outflow of the cooling water. CONSTITUTION: A cooling water supply device for manufacturing a semiconductor comprises a cooling water pipe(21,22), a heat switching portion(20), and a bellows(100,101). The cooling water pipe supplies or discharges the cooling water to a heating electrode(11) for heating a wafer within a process chamber(10). The heat switching portion(20) circulates the cooling water through the cooling water pipe(21,22) and exchanges the heat of the circulated cooling water. The bellows(100,101) covers the cooling water pipe(21,22). Both ends of the bellows(100,101) are fixed at the process chamber(10). The bellows(100,101) is constricted or relaxed according to the heating electrode(11).
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