PLASMA TREATMENT FOR POLYMER REMOVAL AFTER VIA ETCH

摘要

A method and article of manufacture of a via in a semiconductor layered device. The method can include applying an OH/H containing plasma, such as H2O or O2 or a forming gas, to a via which has been etched in a layer of the device. A mixture of oxygen and fluorine-based plasma is applied to complete cleaning of the via to provide a clean via with very little loss of dimensional and surface quality. In another aspect the OH/H containing plasma and the oxygen and fluorine-based plasma are applied together to clean the via.