Connection structure for stackable semiconductor chips e.g. LSI chips, has bump electrode and contact spot electrode at top and bottom faces of chip, and connecting electrodes at front and rear of chip

摘要

A bump electrode (3a,3b,23a,23b) and a contact spot electrode (4a,4b,24a,24b) are respectively formed at the top and bottom faces of a semiconductor chip (1,21). Wiring patterns (5a,5b,25a) connect both bump and spot electrodes to the connecting electrodes (2a,2b,22a,22b) at the front and rear of each chip. When the chips are stacked together, the bump electrode of the lower level chip contacts the spot electrode of the upper level chip.