REACTIVE HOT-MELT ADHESIVE COMPOSITION

摘要

A reactive hot-melt adhesive composition characterized by comprising a cationically polymerizable compound having one or more cyclic ether groups, e.g., epoxy groups, on the average per molecule, a phthalic diester compound represented by formula (2), and a cationic photopolymerization initiator. [In the formula (2), R5 represents (ChH2hO)iH and R6 represents (CkH2kO)lH or (CkH2kO)lCkH2k+1, provided that h, i, k, and l each is an integer of 1 or larger]. The composition cures upon irradiation with actinic energy rays to give an adhesive layer excellent in heat resistance and adhesion to PET.