Component placing method involves aligning positioning element, removing it , applying component and moving on positioning element, and moving positioning element to alignment position

摘要

The method involves mounting a positioning element (1) on a positioning unit and moving it so that the positioning element is aligned in an alignment position with respect to a contact pad field on the circuit board, removing the positioning element from the alignment position and applying and fixing a component (12) to the side of the positioning element facing the pad field, moving the component relative to positioning element contours so that it adopts a defined position in which the contact elements are associated with the positioning element in the same way as the contact pads in the previous step and moving the positioning element back to the alignment position. Independent claims are also included for the following: a component placing device.