| 发明名称 |
METHOD FOR ENCAPSULATING SOLDER METAL POWDERS AND SOLDER METAL POWDERS PRODUCED ACCORDING TO THIS METHOD |
| 摘要 |
<p>A method is disclosed for encapsulating solder metal powders and the microencapsulated metal solder in such a way that the metal powder is reliably protected from external oxidizing influences and the capsule only releases the metal powder as a result of the influence of temperature, without the influence of soldering flux.</p> |
| 申请公布号 |
EP1094915(A1) |
申请公布日期 |
2001.05.02 |
| 申请号 |
EP19990939356 |
申请日期 |
1999.06.15 |
| 申请人 |
SCHULZE, JUERGEN;PROTSCH, WALTER |
发明人 |
SCHULZE, JUERGEN;PROTSCH, WALTER |
| 分类号 |
B23K35/40;B22F1/02;B23K35/02;B23K35/14;B23K35/363;H05K3/34;(IPC1-7):B23K35/14;B22F1/00 |
主分类号 |
B23K35/40 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
