| 摘要 |
<p>A sputter deposition apparatus and method having a sputtering target (10,12) that is tilted and a shield (14,16) that intercepts particulars that may fall from the target so that the particles do not deposit on the workpiece. The arrangement enables the workpiece (20) to be orientated horizontally. More specifically, the sputtering target is mounted higher than the workpiece position and is orientated at an angle of 30 to 60 degrees relative to the vertical axis. The shield occupies an area such that any vertical line (34) extending vertically downward from the front surface of the target to a point on the workpiece intersects the shield above said point.</p> |
