Inspection method and inspection apparatus for printed circuit boards

摘要

An object of the present invention is to provide a high-precision inspection apparatus and inspection method capable of inspecting a large board (1) by laterally moving the board and photographing the board several times before and after the lateral moving. Coordinate positions of correction marks (6a and 6b) applied to a pair of holding members or a pair of rails (2) are read by a line sensor camera (3), an amount of positional discrepancy of the board (1) is computed by comparing coordinate positions of correction marks (6a and 6b) previously set with the coordinate positions of the correction marks (6a and 6b) having been read, and when there are discrepancies between the two kinds of coordinate positions, photographing is carried out after correcting an amount of movement of the holding members (2) based on the amount of positional discrepancy of the board.