发明名称 Semiconductor structure and method of manufacture
摘要 A semiconductor structure (10) having device isolation structures (43, 44) and shielding structures (39, 40). The shielding structures (39, 40) are formed in a semiconductor material (11) and the device isolation structures (43, 44) are formed within the corresponding shielding structures (39, 40). A noise generating device is formed within a first shielding structure (43) and a noise sensitive device is formed within a second shielding structure (44). The two shielding structures (39, 40) are grounded and prevent noise from the noise generating device from interfering with the noise sensitive device.
申请公布号 US6225674(B1) 申请公布日期 2001.05.01
申请号 US19990285532 申请日期 1999.04.02
申请人 MOTOROLA, INC. 发明人 LIM IK-SUNG;MORGAN DAVID G.;JOARDAR KUNTAL
分类号 H01L21/761;H01L21/762;H01L21/763;H01L21/765;H01L23/552;H01L29/10;H01L29/41;H01L29/73;(IPC1-7):H01L29/00;H01L29/76;H01L29/94 主分类号 H01L21/761
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