发明名称 Photoresist stripping liquid compositions and a method of stripping photoresists using the same
摘要 The present invention relates to photoresist stripping liquid compositions comprising (a) 2-30 wt % of a hydroxylamine, (b) 2-35 wt % of water, (c) 25-40 wt % of at least one member selected from monoethanolamine and diethanolamine, (d) 20-32 wt % of dimethyl sulfoxide and (e) 2-20 wt % of an aromatic hydroxy compound and a method of stripping photoresists with the use of the same. The present invention provides photoresist stripping liquid compositions which are, even at higher treating temperatures, excellent in the capabilities of both stripping photoresist films and modified films and effective in prevention of the corrosion that would otherwise occur in substrates overlaid with Al or Al alloy layers or Ti layers, and a method for stripping photoresists by using the same.
申请公布号 US6225034(B1) 申请公布日期 2001.05.01
申请号 US19980173005 申请日期 1998.10.15
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 TANABE MASAHITO;WAKIYA KAZUMASA;KOBAYASHI MASAKAZU;NAKAYAMA TOSHIMASA
分类号 G03F7/42;(IPC1-7):G03F7/42 主分类号 G03F7/42
代理机构 代理人
主权项
地址