发明名称 |
Semiconductor structure with heavily doped buried breakdown region |
摘要 |
A semiconductor structure with a heavily doped buried breakdown region and a method for manufacture. A source region is disposed in a substrate and is doped with dopant of a type opposite that of the substrate. A drain region is disposed in the substrate at the surface and doped with dopant which is the same as that of the source region, and a gate structure is disposed on the substrate between the source and drain regions. A breakdown region is disposed in the substrate below the drain region and is heavily doped with dopant of a type opposite that of the drain region in order to control the value and location of breakdown.
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申请公布号 |
US6225662(B1) |
申请公布日期 |
2001.05.01 |
申请号 |
US19980123596 |
申请日期 |
1998.07.28 |
申请人 |
PHILIPS SEMICONDUCTORS, INC. |
发明人 |
BLANCHARD RICHARD AUSTIN |
分类号 |
H01L29/06;H01L29/10;(IPC1-7):H01L29/76;H01L29/94;H01L31/062;H01L31/113;H01L31/119 |
主分类号 |
H01L29/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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