发明名称 Semiconductor structure with heavily doped buried breakdown region
摘要 A semiconductor structure with a heavily doped buried breakdown region and a method for manufacture. A source region is disposed in a substrate and is doped with dopant of a type opposite that of the substrate. A drain region is disposed in the substrate at the surface and doped with dopant which is the same as that of the source region, and a gate structure is disposed on the substrate between the source and drain regions. A breakdown region is disposed in the substrate below the drain region and is heavily doped with dopant of a type opposite that of the drain region in order to control the value and location of breakdown.
申请公布号 US6225662(B1) 申请公布日期 2001.05.01
申请号 US19980123596 申请日期 1998.07.28
申请人 PHILIPS SEMICONDUCTORS, INC. 发明人 BLANCHARD RICHARD AUSTIN
分类号 H01L29/06;H01L29/10;(IPC1-7):H01L29/76;H01L29/94;H01L31/062;H01L31/113;H01L31/119 主分类号 H01L29/06
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