| 摘要 |
An apparatus for applying material by cathodic arc vapor deposition to a substrate is provided which includes a vessel, a disk-shaped cathode, a platter for supporting the substrate, apparatus for maintaining a vacuum in the vessel, and apparatus for selectively sustaining an arc of electrical energy between the cathode and an anode. The disk-shaped cathode has a first end surface, a second end surface, and an evaporative surface extending between the first and second end surfaces, and the cathode is mounted on a pedestal positioned inside the vessel. The platter has a slot for receiving the pedestal, thereby enabling the platter to be movable into and out of the vessel.
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