发明名称 |
Low dielectric constant polyorganosilicon coatings generated from polycarbosilanes |
摘要 |
Polyorganosilicon dielectric coatings are prepared by subjecting specified polycarbosilanes to thermal or high energy treatments to generate cross-linked polyorganosilicon coatings having low k dielectric properties. The thermal process includes multi-step sequentially increasing temperature heating steps. The instantly prepared polyorganosilicon polymers can be employed as dielectric interconnect materials and film coatings for conductor wiring in semiconductor devices. These polyorganosilicon film coatings have the additional characteristics of relative thermal stability and excellent adhesion to substrate surfaces.
|
申请公布号 |
US6225238(B1) |
申请公布日期 |
2001.05.01 |
申请号 |
US19990327356 |
申请日期 |
1999.06.07 |
申请人 |
WU HUI-JUNG |
发明人 |
WU HUI-JUNG |
分类号 |
C08G77/60;B05D3/06;B05D5/12;C09D183/16;H01L21/312;(IPC1-7):H01L21/31;H01L21/469 |
主分类号 |
C08G77/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|